TO-263-7

Performance Features

• Multi-Pin Parallel Design: Multiple source and drain pins are paralleled within the 7-pin layout, reducing connection resistance and inductance.
• Excellent Thermal Performance: The bottom pad is directly soldered to the PCB, providing an efficient thermal conduction path.
• Low Package Parasitic Parameters: Ideal for high-frequency, high-current switching applications.
• High Current Carrying Capability: Significantly enhances both continuous current and pulsed current handling capacity.

Core Advantages

• Reduced Conduction Losses: The multi-pin parallel design effectively lowers the total connection resistance, minimizing I²R losses.
• Enhanced High-Frequency Performance: Low parasitic inductance reduces voltage overshoot and oscillation, enabling higher frequency operation.
• Improved Heat Dissipation: The large-area bottom pad provides an efficient heat dissipation channel, lowering junction temperature.
• High Power Density Solution: Combines low losses with high current density to achieve high power density designs.

Key Applications

• Energy Storage Systems (ESS): Power Conversion Systems (PCS) or high-voltage bidirectional DC-DC converters.
• Power Tools: Motor drives for high-power cordless drills, chainsaws, and other equipment.
• Battery Management Systems (BMS): High-current charge/discharge protection circuits.
• Industrial Automation: High-power servo drives and Uninterruptible Power Supplies (UPS).

• GSC2D120R022B7
• GSC120R030B7
• GSC3D120R040B7

• GSC120R060B7
• GSC120R080B7
• GSC170R700B7